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| EMP209-Q5 UPDATED 04/24/2008 17.0 - 20.0 GHz Surface-Mounted PA FEATURES * * * * * * 17.0 - 20.0 GHz Operating Frequency Range 29.0dBm Output Power at 1dB Compression 13.0 dB Typical Small Signal Gain -40dBc OIMD3 @Each Tone Pout 18.5dBm APPLICATIONS Point-to-point and point-to-multipoint radio Military Radar Systems Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Ta = 25 C, 50 ohm, VDD=7V, IDQ=760mA) SYMBOL F P1dB Gss OIMD3 Input RL Output RL Idss VDD Rth Tb PARAMETER/TEST CONDITIONS Operating Frequency Range Output Power at 1dB Gain Compression Small Signal Gain Output 3rd Order Intermodulation Distortion @f=10MHz, Each Tone Pout 18.5dBm Input Return Loss Output Return Loss Saturate Drain Current Power Supply Voltage Thermal Resistance 1 MIN 17.0 28.0 11.0 TYP MAX 20.0 UNITS GHz dBm dB 29.0 13.0 -40 -10 -10 -37 dBc dB dB VDS =3V, VGS =0V 860 1070 7 10 1290 8 o mA V C/W C Operating Base Plate Temperature -35 +85 ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION2,3 SYMBOL VDS VGS IDD IGSF PIN TCH TSTG PT CHARACTERISTIC Drain to Source Voltage Gate to Source Voltage Drain Current Forward Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation CONTINUOUS 8V -4 V Idss 15mA @ 3dB compression 150C -65/150C 12.6W 1. Measured result when used with Excelics recommended evaluation board. 2. Operating the device beyond any of the above rating may result in permanent damage. 3. Bias conditions must also satisfy the following equation VDS*IDS < (TCH -THS)/RTH; where THS = ambient temperature Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 1 of 3 May 2008 EMP209-Q5 UPDATED 04/24/2008 17.0 - 20.0 GHz Surface-Mounted PA CHIP OUTLINE AND PIN ASSIGNMENT Top View 0.1970.002 0.1970.002 Bottom View 16 20 EMP209 -Q5 0 REF 0.1970.002 0.049 MAX 0.008 0 REF 0 REF 0.164 15 1 0.042 0.034 0.016 0 REF 11 5 10 6 0.0260.002 0.0120.002 Additional Notes: 1) Ground Plane must be soldered to PCB RF ground 2) All dimensions are in inches 3) Refer to Excelics application notes on QFNs for further guidelines 4) Pin Assignment: Vd Vd 16 20 RFin EMP209 -Q5 Vg 15 1 RFout RFout RFin 11 5 10 6 Vg Pin 1, 2, 4, 5 3 6 7, 8, 9, 10, 11, 12, 14, 15 13 16 17, 18, 19, 20 Assignment NC RFin Vg NC RFout Vd NC Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 2 of 3 May 2008 EMP209-Q5 UPDATED 04/24/2008 17.0 - 20.0 GHz Surface-Mounted PA Recommended Circuit Schematic: 0.1uF 22uF Vd NC NC NC NC Vd NC NC NC NC RFin NC NC EMP209 -Q5 Vg NC NC NC NC RFout NC NC Vg 22uF 0.1uF Notes: 1) External bypass capacitors should be placed as close to the package as possible. 2) Dual biasing sequence required: a. Turn-on Sequence: Apply Vg = -2.5V, followed by Vd = 7V, lastly increase Vg until required Idq b. Turn-off Sequence: Turn off Vd, followed by Vg 3) Demonstration board available upon request. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 3 of 3 May 2008 |
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